JPH0554245B2 - - Google Patents

Info

Publication number
JPH0554245B2
JPH0554245B2 JP59261364A JP26136484A JPH0554245B2 JP H0554245 B2 JPH0554245 B2 JP H0554245B2 JP 59261364 A JP59261364 A JP 59261364A JP 26136484 A JP26136484 A JP 26136484A JP H0554245 B2 JPH0554245 B2 JP H0554245B2
Authority
JP
Japan
Prior art keywords
chip
type electronic
electronic component
external connection
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59261364A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61139018A (ja
Inventor
Atsuo Senda
Takuji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP59261364A priority Critical patent/JPS61139018A/ja
Priority to US06/807,270 priority patent/US4756928A/en
Publication of JPS61139018A publication Critical patent/JPS61139018A/ja
Publication of JPH0554245B2 publication Critical patent/JPH0554245B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Ceramic Capacitors (AREA)
JP59261364A 1984-12-10 1984-12-10 チツプ型電子部品の外部接続用電極を形成する方法 Granted JPS61139018A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59261364A JPS61139018A (ja) 1984-12-10 1984-12-10 チツプ型電子部品の外部接続用電極を形成する方法
US06/807,270 US4756928A (en) 1984-12-10 1985-12-10 Method of forming electrodes of an electronic component of chip type for connecting to the external

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59261364A JPS61139018A (ja) 1984-12-10 1984-12-10 チツプ型電子部品の外部接続用電極を形成する方法

Publications (2)

Publication Number Publication Date
JPS61139018A JPS61139018A (ja) 1986-06-26
JPH0554245B2 true JPH0554245B2 (en]) 1993-08-12

Family

ID=17360812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59261364A Granted JPS61139018A (ja) 1984-12-10 1984-12-10 チツプ型電子部品の外部接続用電極を形成する方法

Country Status (2)

Country Link
US (1) US4756928A (en])
JP (1) JPS61139018A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154501A (ja) * 1987-12-11 1989-06-16 Koa Corp 角形チップ抵抗器
US5145435A (en) * 1990-11-01 1992-09-08 The United States Of America As Represented By The Secretary Of The Navy Method of making composite field-emitting arrays
US5202602A (en) * 1990-11-01 1993-04-13 The United States Of America As Represented By The Secretary Of The Navy Metal-glass composite field-emitting arrays
JP3882954B2 (ja) * 1997-03-19 2007-02-21 Ｔｄｋ株式会社 チップ型積層セラミックコンデンサ
TW558919B (en) * 2001-10-24 2003-10-21 Wistron Corp Method of making member for dual connection plate of circuit board
US20110312222A1 (en) * 2010-06-16 2011-12-22 Tanaka Yokichi J Multi-electrode holders
USD675171S1 (en) 2010-12-16 2013-01-29 Tecella Llc Multi-electrode holder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4011143A (en) * 1973-06-25 1977-03-08 Honeywell Inc. Material deposition masking for microcircuit structures
US4149904A (en) * 1977-10-21 1979-04-17 Ncr Corporation Method for forming ion-implanted self-aligned gate structure by controlled ion scattering
US4278706A (en) * 1977-12-15 1981-07-14 Trx, Inc. Method for making discrete electrical components
US4278707A (en) * 1980-05-19 1981-07-14 Hewlett-Packard Company Method for coating the edge of a printed circuit board to improve its moisture resistance
US4444635A (en) * 1981-07-22 1984-04-24 Hitachi, Ltd. Film forming method
US4469719A (en) * 1981-12-21 1984-09-04 Applied Magnetics-Magnetic Head Divison Corporation Method for controlling the edge gradient of a layer of deposition material
JPS58110024A (ja) * 1981-12-24 1983-06-30 富士通株式会社 セラミツクコンデンサ端子電極組成
JPS58120637U (ja) * 1982-02-10 1983-08-17 株式会社村田製作所 積層磁器コンデンサ
US4554732A (en) * 1982-02-16 1985-11-26 General Electric Company High reliability electrical components
JPS59188108A (ja) * 1983-04-08 1984-10-25 富士通株式会社 端子電極ペ−スト

Also Published As

Publication number Publication date
US4756928A (en) 1988-07-12
JPS61139018A (ja) 1986-06-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term